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Types of target materials: titanium round targets, titanium tube targets, titanium plate targets

The main performance requirements of the target material:

purity

Purity is one of the main performance indicators of the target material, as the purity of the target material has a significant impact on the performance of the thin film. However, in practical applications, the purity requirements for the target material are also different. For example, with the rapid development of the microelectronics industry, the size of silicon wafers has increased from 6 "and 8" to 12 ", while the wiring width has decreased from 0.5um to 0.25um, 0.18um or 0.13um. Previously, 99.995% of the target material purity could meet the process requirements of 0.35umIC, while preparing 0.18um lines required 99.999% or 99.9999% of the target material purity.

Impurity content

The impurities in the solid target material and the oxygen and water vapor in the pores are the main sources of pollution for depositing thin films. Different target materials have different requirements for different impurity contents. For example, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.

density

In order to reduce porosity in the solid target material and improve the performance of sputtered films, it is usually required that the target material has a high density. The density of the target material not only affects the sputtering rate, but also affects the electrical and optical properties of the thin film. The higher the density of the target material, the better the performance of the film. In addition, increasing the density and strength of the target material enables it to better withstand the thermal stress during the sputtering process. Density is also one of the key performance indicators of the target material.

Grain size and grain size distribution

Typically, the target material has a polycrystalline structure, with grain sizes ranging from micrometers to millimeters. For the same target material, the sputtering rate of targets with small grains is faster than that of targets with coarse grains; The thickness distribution of thin films deposited by target sputtering with smaller differences in grain size (uniform distribution) is more uniform.

The use of titanium targets:

Titanium, as a raw material, can be made into titanium sputtering targets through several methods, which are widely used in high-tech fields such as electronics, information industry, home decoration, and automotive glass manufacturing. In these industries, titanium targets are mainly used for surface panel displays of coated integrated circuits, flat panels, and other components, as well as for decoration and glass coating.